Show simple item record

dc.contributor.authorChen, Zengtao
dc.contributor.authorHu, Keqiang
dc.date.accessioned2018-11-06T14:55:32Z
dc.date.available2018-11-06T14:55:32Z
dc.date.issued2018-05
dc.identifierCSME048
dc.identifier.issn978-1-77355-023-7
dc.identifier.urihttp://hdl.handle.net/10315/35260
dc.identifier.urihttp://dx.doi.org/10.25071/10315/35260
dc.description.abstractIn this paper, the transient heat conduction in a layered composite with an insulated interface crack parallel to the boundaries is investigated by using the dual phase lag (DPL) model. Fourier and Laplace transforms are applied and the mixed boundary value problem for the cracked structure under temperature impact is reduced to solving a singular integral equation. The temperature field in time domain is obtained and the intensity factor of temperature gradient is defined. Numerical studies show that overshoot phenomenon may occur due to the combined effect of the insulated crack and application of the DPL heat conduction model. The thermal conductivity and the phase lag parameters have strong influence on the dynamic intensity factor of temperature gradients. The results obtained by the dual phase lag model can be reduced to that by the hyperbolic model and that by the parabolic model.
dc.language.isoenen_US
dc.publisherCSME-SCGMen_US
dc.rightsThe copyright for the paper content remains with the author
dc.subjectComputational Mechanicsen_US
dc.subjectHeat Transferen_US
dc.subjectTransient heat conduction
dc.subjectDual-phase lag model
dc.subjectNon-Fourier heat conduction
dc.subjectSingular integral equation
dc.titleHeat Conduction In A Layered Structure With An Interface Crack Using The Dual Phase Lag Modelen_US
dc.typeArticleen_US


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record


All items in the YorkSpace institutional repository are protected by copyright, with all rights reserved except where explicitly noted.